- composition: 99 % tin / 0,3 % silver / 0,7 % copper
- diameter: Ø 1,0 mm
- higher soldering temperature than others (melting temperature 216-227°C)
- solder: halogen-free No-Clean F-SW32
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TINA-1-100-PBF
45 Item Items
In stock
Warning: Last items in stock!
Availability date:
Quantity | 100g / roll |
9,02 €
Kemo A001 - bending tool for THT components.
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Dual D Type Edge Triggered Flip/Flop
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Bi-FET Monolithic Sample-and-Hold Circuits
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