- Ideal for all rework, solder, de-solder and reflow applications
- Non-corrosive, non-conductive, no-clean
- Tack flux will not run all over PCB when applied
- Has a pleasant odor
- Excellent wetting
- Easily cleaned with isopropyl alcohol (IPA)
- Attachment of BGA spheres
- Soldering flip chip components
- Long stencil life
- Wide process window
- Clear residue For Lead-Free applications
- RoHS 3 and REACH complia